Canteliver Probe Card
MPI Cantilever Probe Card is greatly utilized on gold bump and pad wafer tests for Screen driver, logic, and memory machine. MPI’s cantilever probes are classified as the corresponding answer for the calls for of fine pitch, compact pad size, large pace, fewer cleansing, multi-DUT, high pin count, and ultra-minimal leakage demands. With superb craftsmanship, progressive architecture and established methodologies determined by mechanical and electrical simulation/measurement effects, earning MPI the best cantilever service provider all over the world.
FCB Probe Card
The FCB Probe Card is the most experienced technological know-how of buckling beam probe card. It is actually aimed to obtain the semiconductor ship manufacture time-to-sector (TTM) and price of take a look at (COT) desire. FCB is actually a verified Remedy for a number of semiconductor production tests from early engineering pilot-operates to significant volume manufacturing (HVM). FCB is prepared for machine demanding substantial signal integrity probing (SI) and/or energy integrity probing (PI). Purposes involve slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and even more. FCB guarantees the world’s most effective Over-all Expense-of-ownership (COO) for several DUT programs.
EVS Probe Card
The EVS Probe Card is definitely an improvement above the standard buckling beam probe card. Essential functions are higher latest carrying capacity (C.C.C.) and lessen balanced Call power (BCF), as well as Total MEMS-like traits. EVS can certainly meet the prerequisite of advanced wafer probing. Exact alignment and excellent planarity Management would be the critical elements contributing to steady contact resistance. With its capability and general performance, EVS Probe Card is a great option for advanced probe cards.
Osprey probe card
The Osprey probe card is MPI’s Resolution to demand from customers for ever finer pitch. It really is created for lesser Al pad, and it is ideal for little pitch software with peripheral and full array pattern. With precise alignment and far better planarity Regulate, Osprey can reach greater productivity by multi-DUT layout. The forming wire (FW) form needle produced with MPI’s personal micro fabrication method not merely provides significant-high-quality performance but additionally permits straightforward needle substitute and shortens keeping cycle time.
Kestrel Probe Card
The Kestrel Probe Card is supplied with MEMS wire (MW) needle that's created for the need of minimal power probing. In addition, it comes with the ability to fulfill superior C.C.C. and high pin counts software. The get more info MEMS course of action assures hugely steady needle qualities, as well as the Unique structure structure permits exact alignment and planarity control.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/
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